Call for paper

The topics of interest for submission include, but are not limited to:

📚︎I. Marine Electronic Information

Underwater Acoustic Communication and Networks

Underwater acoustic communication technologies and modem design

Underwater sensor networks (UWSNs) and Internet of Underwater Things (IoUT)

Cross-medium communication (water-air, water-land)

Underwater positioning, navigation, and timing (PNT) systems

Marine Sensing and Monitoring Technologies

Marine environmental monitoring sensors and sensing systems

Ocean remote sensing technologies and signal processing

Seafloor observatory networks and real-time monitoring systems

Electronic systems for AUVs and ROVs

Marine Signal Processing and Information Fusion

Underwater acoustic signal processing and target detection/recognition

Marine big data analytics and AI applications

Multi-source marine information fusion and situational awareness

Marine Communication and Navigation Systems

5G/6G communication technologies for marine environments

Satellite communication and navigation for marine applications

Maritime IoT and smart port technologies

📚︎II. Integrated Circuits and Microelectronics

Analog and Mixed-Signal Integrated Circuits

Low-noise amplifiers, data converters (ADC/DAC)

Filters and sensor interface circuits

Digitally-assisted analog circuit design

Digital Integrated Circuits and Systems

SoC/processor design for marine information processing

Edge AI chips and TinyML accelerators

Memory and in-memory computing architectures

RF and Wireless Communication ICs

RF/mm-wave front-end transceiver chips

Frequency synthesis and clock generation circuits

Wireless power transfer and energy harvesting circuits

Power Management Integrated Circuits

Switched-mode power converters (inductive/capacitive/hybrid)

Linear regulators and low-power power management

Energy harvesting and wireless power supply systems

MEMS and Sensor Integrated Circuits

MEMS sensors and sensor interface ASICs

Marine-specific physical/chemical/biosensor chips

Smart sensors and signal conditioning circuits

Emerging Devices and Process Technologies

Wide-bandgap semiconductor (GaN/SiC) devices and applications

Heterogeneous integration, 3D integration, and chiplets

Silicon photonics integration and photodetectors

EDA and Chip Design Methodologies

Design tools for marine electronics ASICs

Modeling, simulation, and verification techniques

PDK and design-technology co-optimization (DTCO)

📚︎III. Interdisciplinary Directions

AI chips and intelligent processing for marine applications

Reliability and environmental adaptability of ICs in marine equipment

Packaging and system-in-package (SiP)/system-on-package (SoP) for marine electronics

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