About eICocean 2027
Amid China’s continued efforts to build a maritime power and the growing emphasis on self-sufficiency in the integrated circuit industry, the convergence of marine electronic information and integrated circuit technologies has become an important driver of innovation in marine science and technology. The 2027 International Conference on Electronic Information and Integrated Circuits for Ocean (eICocean 2027) will be held in Qingdao, China, from April 9 to 11, 2027. Hosted by Ocean University of China, the conference aims to bring together leading scholars and industry experts from around the world in the fields of remote sensing, marine information, and chip design to exchange ideas on frontier technologies and emerging trends.
As an emerging hub for China’s marine electronic information industry, Qingdao has built an innovation ecosystem spanning sensing, transmission, storage, computing, and applications across the value chain, and has achieved significant progress in interdisciplinary areas such as underwater quantum communication and deep-sea exploration and observation. Building on this strong foundation, the conference will focus on recent advances in marine remote sensing, dedicated integrated circuit design for marine applications, and optoelectronic integration, while addressing critical challenges such as high-sensitivity detection in extreme marine environments, low-power chip design, and system-level integration and validation. As the host institution, Ocean University of China has leveraged its strengths in marine science and integrated circuit technologies to make notable advances in strategic science and technology development and industry–education integration. eICocean 2027 will provide an international platform for researchers to present their work and exchange expertise, while fostering collaboration between academia and industry and supporting the advancement of both theory and technology in marine electronic information and integrated circuits.
Conference Info.
🗓︎Important Dates
Full Paper Submission Date: January 24, 2027
Notification of acceptance: February 23, 2027
Registration Deadline: March 10, 2027
Final Paper Submission Date: March 25, 2027
Conference Dates: April 9-11, 2027
🗺︎Venue: Qingdao, China
Call For Papers
📚︎I. Marine Electronic Information
Underwater Acoustic Communication and Networks
Underwater acoustic communication technologies and modem design
Underwater sensor networks (UWSNs) and Internet of Underwater Things (IoUT)
Cross-medium communication (water-air, water-land)
Underwater positioning, navigation, and timing (PNT) systems
Marine Sensing and Monitoring Technologies
Marine environmental monitoring sensors and sensing systems
Ocean remote sensing technologies and signal processing
Seafloor observatory networks and real-time monitoring systems
Electronic systems for AUVs and ROVs
Marine Signal Processing and Information Fusion
Underwater acoustic signal processing and target detection/recognition
Marine big data analytics and AI applications
Multi-source marine information fusion and situational awareness
Marine Communication and Navigation Systems
5G/6G communication technologies for marine environments
Satellite communication and navigation for marine applications
Maritime IoT and smart port technologies
📚︎II. Integrated Circuits and Microelectronics
Analog and Mixed-Signal Integrated Circuits
Low-noise amplifiers, data converters (ADC/DAC)
Filters and sensor interface circuits
Digitally-assisted analog circuit design
Digital Integrated Circuits and Systems
SoC/processor design for marine information processing
Edge AI chips and TinyML accelerators
Memory and in-memory computing architectures
RF and Wireless Communication ICs
RF/mm-wave front-end transceiver chips
Frequency synthesis and clock generation circuits
Wireless power transfer and energy harvesting circuits
Power Management Integrated Circuits
Switched-mode power converters (inductive/capacitive/hybrid)
Linear regulators and low-power power management
Energy harvesting and wireless power supply systems
MEMS and Sensor Integrated Circuits
MEMS sensors and sensor interface ASICs
Marine-specific physical/chemical/biosensor chips
Smart sensors and signal conditioning circuits
Emerging Devices and Process Technologies
Wide-bandgap semiconductor (GaN/SiC) devices and applications
Heterogeneous integration, 3D integration, and chiplets
Silicon photonics integration and photodetectors
EDA and Chip Design Methodologies
Design tools for marine electronics ASICs
Modeling, simulation, and verification techniques
PDK and design-technology co-optimization (DTCO)
📚︎III. Interdisciplinary Directions
AI chips and intelligent processing for marine applications
Reliability and environmental adaptability of ICs in marine equipment
Packaging and system-in-package (SiP)/system-on-package (SoP) for marine electronics
Publication
All papers will be reviewed by two or three experts from the committees. After a careful reviewing process, all accepted full papers will be published by Conference Proceeedings and will be submitted to EI Compendex, Scopus for indexing.
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Note: All submitted articles should report original research results, experimental or theoretical, not previously published or under consideration for publication elsewhere. Articles submitted to the conference should meet these criteria. We firmly believe that ethical conduct is the most essential virtue of academics. Hence, any act of plagiarism or other misconduct is totally unacceptable and cannot be tolerated.
Sponsor
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